水冷散熱器可以以更小尺寸來設計制作，它能將熱量很快傳遞出去而迅速降低溫度，能顯著提高電子產(chǎn)品壽命，適合于大功率電子產(chǎn)品。其特征如下：
l 小體積，大散熱
l 適合所有IGBT模塊
l 保持電子設備內(nèi)溫度一致
Liquid cooling offers the designer a significant advantage in reducing package size and increasing semiconductor life. The use of liquid cooling increases heat removal and decreases temperature rise due to the increased efficiency of the medium. Smaller, acoustically quieter, higher power output systems can be achieved.
§ Maximizes cooling in a compact package
§ Fits all standard IGBT module sizes
§ Maintains uniform temperature under devices
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